ECP S-Bend Ceramic Feedthrough

AMETEK ECP Unveils New S-Bend Ceramic Feedthrough Design for High-Speed Transmission Applications

ECP S-Bend Ceramic Feedthrough

ECP S-Bend Ceramic Feedthrough


April 10, 2015

NEW BEDFORD, MA— AMETEK Electronic Components & Packaging unveiled its new S-Bend Ceramic Feedthrough design at this year’s Optical Fiber Communications (OFC) Conference in Los Angeles.

The S-Bend Ceramic Feedthrough is a new high-speed transmission design for receiver and modulator applications. The patent-pending design incorporates a curved s-bend cross section, which provides a smooth uninterrupted RF signal path.
This new design provides a high-frequency interconnect advantage by eliminating 90-degree transitions (vertical vias and stair-step vias) used in conventional feedthrough designs.

The s-bend design effectively eliminates the RF reflection caused by 90-degree via transitions. An increase in bandwidth performance is achieved as the result of the reduced reflection coefficient (no via transitions), which offers the related benefits of reduced return loss and reduced transmission loss.

"The feedback we received from customers attending OFC was amazing. The S-Bend Ceramic Feedthrough provides a breakthrough solution to manage the requirement for increased RF signal performance in microelectronic packages. This design satisfies the ever increasing demand for higher frequencies and greater bandwidth in optical communications." says Ken McGillivray, Vice President, Ceramic Technology

AMETEK Electronic Components & Packaging (ECP) is a leading provider of electronic and electromechanical packages for harsh environment and reliability sensitive applications. AMETEK ECP serves customers in the aerospace, defense, automotive, industrial, medical, optical communications and oil and gas industries.

AMETEK ECP is a unit of AMETEK Inc., a leading global manufacturer of electronic instruments and electromechanical devices with annual sales of $4 billion.

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