BERLIN, Germany, May 6, 2013
VI Systems GmbH announces today that the first of the three allowed patents, entitled “Opto-electronic assembly for high speed transmission” is essential to protect VIS’ proprietary concept of optoelectronic assembly for high speed signal transmission based on surface-emitting/receiving components  allowing electrical (–3dB) bandwidth in the TO-can package to be increased to 90GHz. The concept is suitable for single channel links and also extended to multichannel data transmission. This IP is, for example, applied to VIS’ 850 nm multimode fiber receiver subassemblies operating at 50Gb/s, whereas these subassemblies are using VIS PIN photodetectors and transimpedance amplifiers. It is expected that in mass production such a microassembly will not cost more than only a few dollars.


R50-850: 700-890nm receiver (ROSA) for 50 Gbit/s

The second patent, entitled “Optoelectronic interconnect for high frequency data transmission at low power consumption” describes the requirements allowing optical links each suitable for transmission of optical signals at speeds at and above 20 Gigabit per second at power consumption below 10 milliWatt per Gigabit per second. The interconnect includes also optical transmitters and detectors having capacitances below 150 femto-Farads.

The third patent, entitled “Method for encoding and decoding of optical signals” addresses a robust multilevel coding scheme, where the transmitter is fast, and the receiver is slow such that the response time of the receiver exceeds at least the shortest of the durations of the optical pulses.

VIS offers engineering samples of their fiber coupled 50 Gbit/s photodetector module for 850nm wavelength (part no. R50-850). The company has started shipping testboard sets of its fiber coupled 4 x 25 Gbit/s parallel optical transmitter (VHXT5204A-840) and receiver (VHXR5204A-840).

VI Systems’ CEO Nikolay Ledentsov commented: “This is an important achievement for the company in a time when the optical link technology moves to 26-28 Gb/s in 2013 and the standardization work on 56Gb/s  per channel is going to be completed by the end of 2014. At these bit data rates a key requirement for the success is the realization of low cost, compact and energy-efficient integrated optical assemblies, including heat dissipation and cross-talk considerations”. A huge market of optical interconnects is arising in high-performance computing with modern systems already requiring 60 thousands optical links per single rack (IBM). The number of optical links per system increases two orders of magnitude each 5 years, with modern systems absorbing millions of VCSEL and PIN-based optical links, presently at 10-14 Gb/s.