Jena, Germany, September 5, 2016
ZEISS introduces the new ZEISS ForTune system for photomask tuning. With its latest optical design, it takes two main mask tuning processes to the next level in terms of efficiency, accuracy and throughput. The first tool has already been delivered to the first customer.
The new ZEISS ForTune mask tuning system combines the capabilities from ZEISS CDC and RegC® in a new advanced system. This means mask registration and Critical Dimension Uniformity (CDU) can be completed in one process. It helps to:
- Expand the Lithography Process Window and reduce the wafer intrafield hot spots (using the CDC technology)
- Improve wafer intra-field On-Product Overlay and enhance Mask Image Placement (using the RegC® technology)
ZEISS ForTune is a state-of-the-art technology with advanced system and optics design, allowing for high process efficiency and prediction accuracy, as well as for significantly improved output. The mask tuning system has been first introduced to Wafer Fab customers at the SEMICON West in San Francisco, USA in July 2016 and was much appreciated. “In order to produce IC devices at sub-16nm design nodes, semiconductor manufacturers are integrating many novel technologies, including multiple patterning, spacer pitch splitting, 3D logic and memory structures, new materials and complex reticles. Using these new technologies requires tight specifications for On-Product Overlay, Mask Registration, and Lithography Process Window. ForTune® is a powerful new technology that enables Mask Makers and Wafer Fabs to tackle these challenges in a fast and cost-effective way”, states Ofir Sharoni, Product Manager of ZEISS ForTune in Karmiel, Israel. Another presentation of the new system will take place at the SPIE Photomask Conference in September 2016 in San Jose, USA.
Besides the official product launch, the next generation Wafer and Mask Tuning System has already been successfully delivered to an US based chip manufacturer, who ordered the new ZEISS ForTune system earlier this year.
More information here:
