Waterloo, CANADA ─ June 23, 2020 ─ Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company and global leader in machine vision technology, is pleased to introduce a 512 short-wave infrared (SWIR) line scan camera for machine vision. The latest Linea SWIR model features a cutting-edge InGaAs sensor in a compact format suitable for a variety of applications including food and packaged good inspection, recycling, mineral sorting and solar and silicon wafer inspection.
Like the 1k model, this newest Linea SWIR camera delivers exceptional responsivity and low noise, and allows customers to inspect beyond the visible range. It offers highly responsive 25 µm pixels, 40 kHz line rate, cycling mode, programmable I/Os, power over Ethernet (PoE), precision time protocol (PTP), and more.
To learn more about the Linea SWIR line of cameras, features, benefits and applications for seeing beyond the visible, join our webinar “Introduction to Linea SWIR line scan” taking place June 30, at 9:00 am (EDT). Register here.
Key Features:
- High responsivity low noise sensor
- GigE interface
- HDR and Cycling modes
- High dynamic range
- Programmable I/Os
For more information about the Linea SWIR visit the website.
Teledyne DALSA is part of the Teledyne Imaging group and a world leader in the design, manufacture and deployment of digital imaging components for the machine vision market. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are used in thousands of automated inspection systems around the world and across multiple industries including semiconductor, solar cell, flat panel display, electronics, automotive, medical, packaging and general manufacturing. For more information, visit www.teledynedalsa.com/mv.
