LAS VEGAS, Nevada – Jan. 5, 2015 - ON Semiconductor (Nasdaq: ONNN), driving energy efficient innovations, has announced the latest addition to its expansive range of imaging products with the introduction of its next-generation 13 megapixel (MP) image sensor - the AR1335. Based on advanced 1.1 micron (µm) pixel technology, the AR1335 sets a new benchmark in sensitivity along with dramatic increases in quantum efficiency (QE) and linear full well capacity. Designed specifically for smartphone camera applications, this image sensor delivers a near digital still camera quality experience with power consumption and footprint that are optimized for mobile devices.
ON Semiconductor has developed its innovative 1.1 µm pixel technology for performance smartphone sensors with cutting-edge pixel and color filter array (CFA) processing advancements, which has increased the sensitivity by nearly 20 percent compared to the previous generation. This world-class sensitivity allows for more light to be captured so image quality is significantly improved, especially in low light.
The AR1335 is designed to deliver a great imaging experience for smartphones. With its world-class sensitivity, QE, and linear full well, customers will experience realistic low-light images. Its super-crisp 13MP resolution supports high-quality zoom, and sharp reproduction of scene details. Professional quality video is supported thorough 4K Ultra-High Definition (UHD) and Cinema formats at 30 frames per second (fps) and Full HD 1080P at 60 fps. The high 32-degree Chief Ray Angle (CRA) supports low z-height applications.
“The AR1335 image sensor comes from an intersection of engineering innovation and customer focus,” said Shung Chieh, vice president of Consumer Imaging for ON Semiconductor’s Image Sensor Group. “Technology improvements, coupled with smart design and optimized production processes, result in a cost effective solution for smartphone manufactures who wish to deliver a full, rich camera experience in their devices.”
The AR1335 is in mass production in die format and has been designed into several smartphone models with availability in leading phones expected by the second quarter of 2015.
For more information, visit http://www.onsemi.com.
